Solar wafer cutting, Wafer dicing

Laser type:  Picosecond laser

Process material with thicknesses from 0.001mm–1mm

Kerf width as thin as 0.020mm

Positioning accuracy of moving platform: +/- 3um 

Smallest side damage: 15um

Silicon wafer laser cutting, Silicon Wafer dicing, Silicon Wafer scribing

Picosecond laser is a high throughput, cost effective and simple way for wafer scribing, wafer cutting,wafer dicing with hight accuracy and long term reliability.

Laser used to scribe silicon wafer, it causes partial cut lines on the wafer. This lines introduces regions of weakness. This is usually followed by a mechanical breaking procedure to produce silicon rectangular tiles for subsequent operations.he mechanical break will follow allowing the scribing line offering the least path of resistance. 

Application of wafer laser cutting, dicing, scribing: 

The laser machine can cut the thin slice of semiconductor, crystalline silicon (c-Si), integrated circuits, photovoltaics, solar cells,microelectronic devices.

Silicon wafer including Polished Wafers, HI-WAFER®, Hyper HI-WAFERS®, AT-WAFER, Epitaxial Wafers, Diffused Wafers, SOI Wafer